Plasma System Engineering & Process Consulting
Mihana Tech provides expert plasma system engineering across process design, system specification, diagnostics and independent validation. Our work spans RF and DC plasma sources, magnetron sputtering, inductively coupled plasma (ICP) and plasma-enhanced processes for thin-film deposition, surface treatment and advanced materials applications. We bring the same depth of scientific understanding to plasma technology that underpins our VIG and vacuum system work.
What We Offer
Plasma Process Design
End-to-end process design for new plasma systems — source selection, operating parameter definition, power supply and matching network specification, and gas handling configuration.
System Engineering & Specification
Plasma chamber design, electrode geometry, substrate handling and vacuum integration. We help you specify a system that delivers your target process reliably and reproducibly.
Process Validation & Optimisation
Independent assessment of existing plasma processes. We characterise process performance, identify sources of variability and provide evidence-based recommendations for improvement.
Thin-Film Deposition Consulting
Process design and validation for magnetron sputtering, PECVD and related plasma deposition techniques. Includes target selection, deposition rate characterisation and film property evaluation.
Plasma Diagnostics
Measurement and characterisation of plasma parameters including electron density, ion flux, optical emission spectroscopy (OES) and process gas analysis. Supports both development and in-process monitoring.
Low-E Coating Process Support
Specialist expertise in the plasma deposition and validation of low-emissivity coatings for VIG and advanced glazing. Directly integrated with our optical and thermal characterisation capabilities.
Applications
Plasma technology appears across a wide range of advanced manufacturing and research contexts. Areas we regularly support include:
Technical Capabilities
Magnetron Sputtering Process Design
Design and optimisation of DC and RF magnetron sputtering processes for metallic, oxide and nitride thin films. We address target utilisation, deposition uniformity, reactive process control and film stress management — the practical challenges that determine whether a sputtering process is manufacturable.
RF & ICP Plasma System Engineering
Design and specification of RF-driven plasma sources for deposition, treatment and etching applications. Includes matching network design, impedance characterisation and power coupling optimisation. ICP source configuration for high-density plasma requirements.
Optical Emission Spectroscopy (OES)
In-situ plasma diagnostics using OES to characterise plasma chemistry, identify reactive species, monitor process endpoint and detect contamination. A non-invasive tool for both process development and production monitoring.
Thin-Film Characterisation
Deposited film characterisation using ellipsometry, UV-Vis/NIR spectrophotometry, XPS and SEM. We measure film thickness, optical constants, composition, morphology and surface roughness — giving you a complete picture of what your plasma process is producing.
See our Facilities page for the full analytical capability list.
Plasma–Vacuum Integration
Plasma processes operate within vacuum systems, and the two cannot be treated independently. Mihana Tech's combined expertise in plasma engineering and vacuum system science means we assess and optimise both simultaneously — a capability that is rare in independent consulting.
Discuss a Plasma Systems Project
Whether you are designing a new plasma system, validating an existing process, or seeking independent expertise on thin-film deposition, we are ready to help. Get in touch directly for a straightforward technical discussion.